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Hot Melt – Trouble Shooting Tips

Home Hot Melt – Trouble Shooting Tips

Problem Possible CauseSuggested Solution
StringingApplication temp. too lowRaise application temp. DO NOT exceed recommended application temp.
Viscosity of adhesives is HIGHRaise application temp. DO NOT exceed recommended application temp.
Substrate is too far from applicator tip.Position substrate closer to tip.
Substrate temp. is too coldPre-warm substrate to increase surface temperature.
Poor nozzle shut offClean Nozzle and repair. If problem persists, contact equipment manufacturer.
Charring/Gelling in ReservoirReservoir temp. too highLower reservoir temperature
Faulty heating controlCheck control and replace
Surface oxidationMaintain level of adhesive in reservoir. Keep reservoir covered; with some adhesives, nitrogen blanket may be necessary.
Dripping NozzleWorn needle or seatReplace
Nozzle dirtyClean or replace
Air in Adhesive at Applicator TipExtrusion head faultyConsult with the manufacturer for a recommendation
Reservoir is out of adhesive.Bleed lines and refill reservoir. Reset or replace valve.
Poor AdhesionAdhesive bond shows that the glue film is mostly on one surface which is caused by improper penetration of the secondary surface.A) Apply heavier glue film and/or apply adhesive hotter. Sometimes both approaches are necessary.

B) In the case of very conductive surfaces (metals) the substrate may have to be preheated to assure proper penetration of the secondary substrate.
Bond failure shows adhesive on both surfaces with leggy strains.Usually caused by disturbing the Bond during the setting stage.A) Check compression to assure that there is no shifting during adhesive set up.

B) Apply less adhesive.

C) Lower adhesive Temperature.
Poor penetration of substrate coatingA) Apply adhesive hotter.

B) Combine substrates quicker.

C) Lower adhesive temperature.
Glossy adhesive surface usually caused by poor contact with the secondary substrate. Temperature too low for proper wet out.A) Adjust compression to assure intimate contact of substrates.

B) Increase adhesive temperature.
Substrates Popping openHot melt is not cooling rapidly enoughA) Lower application temperature.

B) Decrease amount of adhesive applied.
Substrate is too hot to achieve proper cooling of adhesiveCool substrates to room temperature if possible.

For more detailed hot melt trouble shooting tips, or to speak with a technical representative about your application, and to request samples, please call us at 1-800-249-0337 or email us at [email protected]

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